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Project |
Mass production |
Pattern |
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Panel type |
Single/double-sided boards, multi-layer boards, HDI boards, thick copper boards, high-frequency high-speed boards, aluminum/copper substrates, soft/hard combined boards, multilayered hybrid boards, etc. |
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Board size |
20”× 40” |
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Number of layers |
2-34 Layer |
Up to 36th to 40th floor |
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Plate thickness |
0.3-5.0mm |
0.2-6.0mm |
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Minimum line width/Pitch |
2/2mil |
1.6/1.8mil |
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Minimum bore diameter of the mechanical drill |
0.20mm |
0.15mm (Plate thickness< 3.0mm) |
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Minimum pore diameter of non-metalized pores |
0.20mm |
0.15mm |
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Thick-to-thin ratio |
10:1 |
20:1 |
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Via filling/Seongkon |
Anti-soldering ink hole-blocking、Resin hole filling、Hole in the plate、Electroplated filling holes Capacity for self-control0.20~0.60mm |
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HDI Structure |
3+N+3（First order, second order, third order） |
4+N+4（Fourth order） |
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Blind hole/Cross-layer blind holes |
Maximum depth-to-diameter ratio (B/A) |
0.80 : 1 |
0.85: 1 |
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Minimum aperture (A) |
3.0mil |
3.0mil |
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Pad (of a component)(C)/"Conductive pads"(D) |
A+7mil min |
A+6mil min |
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Impedance control |
±10%（Z≥50 Ω）；±5Ω（<50Ω） |
±8%（Z≥50Ω）；±3~5Ω（Z<50Ω） |
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Special processing capabilities |
Back drill, stepped groove/Tread boards, edge-wrapped copper, half-hole plates |
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Surface treatment |
OSP, gold plating, silver plating, tin plating, gold finger electroplating, thick gold, nickel-palladium gold, lead-free soldering tin, electroplated hard gold |
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